Raith?s calendar for 2021
Raith would like to provide you with a free copy of our well-known wall calendar. For the first time it is a Best-Of version including…
Author: pr@-k@n-@dmin
The latest Raith?s newsletter is available!
Raith's latest newsletter is available! And in it: Information about conferences and events “on line”; Product news; Information about the special Micrograph Award; A wall…
Every start is hard? Not for wirebonding with F&S Bondtec bonders!
Our entry-level series 53 is a blockbuster with almost 700 installed units and counting. It delivers superior bond quality and yet is unrivalled in its…
A brand-new Raith website is live.
Focusing on improved functionality, responsive web design and engaging content the company hope to provide a better user experience to find appropriate information in an…
EVG Rolls Out Maskless Lithography for High-volume Manufacturing
LITHOSCALE addresses lithography needs for markets and applications that require a high degree of flexibility or product variation, including advanced packaging, MEMS, biomedical and IC…
The new edition of Bondtec bonders 56xx series – Series 56i
It was one of the milestones in our company’s history – F&S BONDTEC is the first and still the only manufacturer to offer a machine…
Raith User On line meeting
You are cordially invited to attend the “Raith User Meeting Europe” which will be held on September 14-17 online using goToWebinar. Individual days will be…
EV Group Completes Construction of State-Of-The-Art Cleanroom Facility at Corporate Headquarters
Newly opened Cleanroom V building nearly doubles cleanroom capacity and strengthens capabilities of EVG?s NILPhotonics? and Heterogeneous Integration Competence Centers. It houses a modern training…
Raith ? 40 years of success
When Hermann Raith founded Raith https://www.raith.com/ in Dortmund in 1980, he could never have imagined that four decades later his business would become a leading…
A new MCS-20 Mobile Calibration System from F&S Bondtec Semiconductor
Bondtec offers a new MCS-20 for bond force calibration for bond weights up to 2,500 gf. The software-supported calibration enables the observation of force overtime as…
A series of three webinars on FIB-SEM nanofabrication organized by Raith soon.
Due to the Covid-19 pandemic, all events are canceled. So we are putting together some webinar series. The first series focusses on FIB-SEM nanofabrication. Focused…
Giga pixel scan of the entire image of the “Girl with a Pearl Earring” using a HIROX microscope.
A full high-resolution scan of the “Girl with a Pearl Earring” image was made using the Hirox 3D Digital Microscope RH-2000 in Mauritshuis in The…
The latest innovation in 3D Digital Microscopy
Hirox has launched a new model HRX-01 of the digital microscope! The HRX-01 is the result of over 40 years of optical manufacturing from Hirox…
EVG established the Heterogeneous Integration Competence Center?
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets established the Heterogeneous Integration Competence Center?,…
Best Practice Guide for the Creation of Battery Packs using Ultrasonic Wire Bonders
Due to increasing inquiries from various industries, F&S Bondtec Semiconductor has compiled a Best Practice Guide for the Creation of Battery Packs using Ultrasonic Wire…
EUROLAB 2020: CANCELLED – individual presentation of Hirox microscopes via the Internet is possible
Due to the current epidemiological situation and rapid spread of coronavirus (SARS-Cov-2), the organizers decided to CANCEL EuroLab 2020 and CrimeLab 2020. As an alternative…
The F&S BONDTEC Semiconductor company – a manufacturer of wire bonders operates without interruption and is still available to the customers.
In view of the general uncertainty about the new corona virus (COVID-19) and the current economic impact, we would like to provide you with all…
EVG invites to their stand at SEMICON EUROPA 2019
EVG https://www.evgroup.com/ leading supplier of equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices invites to visit…
F&S Bondtec Semiconductor www.fsbondtec.at celebrates their 25th anniversary!
The next PRODUCTRONICA trade fair will take place from 12.11-15.11.19 in Munich. The F&S Bondec company invites you to visit their booth: Hall B2 /…
Digital video mikroscope 3D HIROX at EUROLAB & CRIMELAB 2019
Digital video microscope 3D HIROX will be presented at the International Fair of Analytical and Measurement Technologies Eurolab 2019 www.targieurolab.pl / Crimelab Forensic Technology Fair…
Velion, Raith product. FIB-centric nanofabrication. Four modes. Two beams. One system.
VELION is a novel FIB-SEM instrument in which FIB nanofabrication has matured into the standard technique for fabricating three dimensional and high resolution nanostructures, such…
Raith during 47th ?Jaszowiec? International School & Conference on the Physics of Semiconductors 16-22.06.2018
During 47th ?Jaszowiec? International School & Conference on the Physics of Semiconductors Martin Kirchner of Raith company gave an oral presentation entitled: Quantum Devices made…
Bondtec Series 58XX – the fully automatic bonder on a desktop BIGGER, FASTER, SMARTER
Can do everything a fully automatic wire bonder can do, but fits on a table: this is our Series 58XX. With the latest developments the…
Digital video microscope 3D HIROX at the exhibition during the Evertiq Conference TEC Warsaw seminar
We are pleased to announce that also this year the HIROX microscope will be present at the exhibition during the The Evertiq Conference, TEC Warsaw…
Digital video microscope 3D HIROX at EUROLAB 2018
We are pleased to announce that we will be exhibiting the HIROX digital video microscope www.hirox-europe.com at the International Fair of Analytical and Measurement Technology Eurolab 2018…
Raith informs about many events planned for the spring of 2018.
Raith informs about many events planned for the spring of 2018: Raith’s European Nano seminar 2018 Raith at the spring DPG meeting Industrial Forum Session…
Productronica and Semicon in Munich 14-17.11.2017
Już w przyszłym tygodniu 14.11-17.11.17 w Monachium odbędą się kolejne targi PRODUCTRONICA http://productronica.com/index-2.html W tym roku, w tym samym czasie odbędzie się również SEMICON Europa http://productronica.com/trade-fair/parallel-events/semicon-europa/index.html Z…
EMPC 2017
On September 10-13th, 2017 at the Warsaw University of Technology there was an international conference EMPC 2017 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE www.empc2017.pl The conference…
HIROX during the KKE 2017 conference
Traditionally, during the National Electronics Conference in Darłowko on 5-9.06.17, participants could learn the functions of the 3D HIROX digital microscope and examine their samples….
Austrian company F & S Bondtec Semiconductor is placing an innovation in the pull testing market.
A new, high quality wire bond pull tester LAB-TESTER 101 was presented at SMT in Nürnberg. Small, compact, manual pull tester with the cutting-edge software…
Raith users meeting
On 25 April there was organized in Warsaw, at Institute of Physics PAS Raith users meeting. The meeting goal was to initate and maintain communication…
HIROX at Eurolab 2017
Once again exhibited at the Eurolab / Crimelab fair in Warsaw on 29-31.03, digital video microscope Hirox met with great interest of visitors. Such microscope…
Presentation of the HIROX microscope at the Rzeszów University of Technology
On March 14, the Faculty of Electronic and Telecommunications Systems of the Rzeszów University of Technology organized a presentation of the digital video 3D microscope…
RAITH NANO2017 – 23rd seminar on electron and ion beam based nanofabrication.
On days: 06.03-08.03.17 there was organized Raith Nano2017 seminar in Dortmund. The seminar covered the basics and principles of electron beam lithography and FIB nano…
A new approach for Ultra High Resolution Imaging in Biology
For years the RAITH CHIPSCANNER (https://www.raith.com/products/chipscanner.html) solutions have been used in semiconductor industry and intelligence service agencies. The tools originally developed for professionals dealing with integrated circuit design…
From Micro Fluidics to Plasmonics: New horizons with the new ionLINE Plus FIB by RAITH
RAITH (https://www.raith.com/), the leading manufacturer of R&D nanofabrication tools, releases its new ionLINE Plus FIB nanofabrication tool at the MNE conference in Vienna. FIB-SEM tools…
eWrite by Raith: A new high Speed & high Resolution Lithography Technology for Research
High resolution lithography was and is the desire of many scientists and engineers. Tools based on a single focused electron beam deliver sub 10nm writing…
Great interest of Hirox microscopes during the Eurolab trade show
12-14 April was the 18th International Trade Fair of Analytical, Measurement and Control Technology EuroLab and the 5th International Forensic Technology Fair CrimeLab, held at the MT…
New standards in flexible high precision die-bonding
F&S Bondtec has just announced an advanced die-bonding solution to complement its flexible manual wire-bonding platform. The new 5380 P&P makes die-bonding as simple and…
Raith Nano2016 22nd seminar on electron and ion beam fabrication for nanotechnology
From 15.02 to 17.02 was held Raith seminary in Dortmund. This seminar is targeted on those who think about investing into Electron Beam Lithography or FIB…
Automation and throughput: Raith launches new Electron Beam Lithography tool
Given the size of a focused electron beam (on the order of one nano meter), electron beam lithography is an enabling technology for nano research….