EV Group Doubles Throughput of Innovative Semiconductor Layer Transfer Technology
The EVG®880 LayerRelease™ system from Austrian company EVGroup is a fully automated, next-generation platform for the transfer of thin semiconductor layers in high-volume production (HVM).
Key Features and Innovations:
• Doubled Productivity: The new EVG880 platform delivers twice the productivity of previous-generation solutions.
• Innovative Infrared (IR) Technology: The system utilizes an IR laser passing through silicon and special inorganic release materials. This allows for precise layer debonding with nanometer precision.
• Eliminates the need for glass substrates and organic adhesives, removing temperature constraints and improving compatibility with front-end production processes.
• Comprehensive Solution: The system combines laser exposure, wafer debonding, and wafer cleaning in a single machine.
• Application: The technology enables advanced packaging (e.g. 3D IC, ultra-thin chiplet stacking) for advanced logic, memory and power devices.