{"id":1704,"date":"2022-09-05T16:22:08","date_gmt":"2022-09-05T14:22:08","guid":{"rendered":"https:\/\/prokon-elektronika.pl\/?p=1704"},"modified":"2022-10-17T16:28:48","modified_gmt":"2022-10-17T14:28:48","slug":"ev-group-achieves-die-to-wafer-fusion-and-hybrid-bonding-milestone-with-100-percent-die-transfer-yield-on-multi-die-3d-system-on-a-chip","status":"publish","type":"post","link":"https:\/\/prokon-elektronika.pl\/en\/ev-group-achieves-die-to-wafer-fusion-and-hybrid-bonding-milestone-with-100-percent-die-transfer-yield-on-multi-die-3d-system-on-a-chip\/","title":{"rendered":"EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-On-A-Chip"},"content":{"rendered":"<p>Successful full-system die-to-wafer transfer at EVG\u2019s Heterogeneous Integration Competence Center\u2122 demonstrates important step forward in achieving process maturity<br \/>\nEV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG\u2019s GEMINI\u00aeFB automated hybrid bonding system. Such an accomplishment had been a key challenge for D2W bonding until today, as well as a major hurdle to scaling down the cost of implementing heterogeneous integration. This important industry achievement was carried out at EVG\u2019s Heterogeneous Integration Competence Center\u2122 (HICC), which is designed to assist customers in leveraging EVG\u2019s process solutions and expertise to accelerate the development of new and differentiating products and applications driven by advances in system integration and packaging.<br \/>\nFor more information on EVG\u2019s Heterogeneous Integration Competence Center (HICC), please visit: <a href=\"https:\/\/www.evgroup.com\/products\/process-services\/heterogeneous-integration-competence-center\/.\">https:\/\/www.evgroup.com\/products\/process-services\/heterogeneous-integration-competence-center\/.<\/a><\/p>\n","protected":false},"excerpt":{"rendered":"<p>Successful full-system die-to-wafer transfer at EVG\u2019s Heterogeneous Integration Competence Center\u2122 demonstrates important step forward in achieving process maturity EV Group (EVG), a leading provider of&#8230;<\/p>\n","protected":false},"author":3,"featured_media":839,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[123],"tags":[],"class_list":["post-1704","post","type-post","status-publish","format-standard","has-post-thumbnail","hentry","category-news"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/posts\/1704","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/comments?post=1704"}],"version-history":[{"count":1,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/posts\/1704\/revisions"}],"predecessor-version":[{"id":1705,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/posts\/1704\/revisions\/1705"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/839"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=1704"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/categories?post=1704"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/tags?post=1704"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}