For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications.<\/p>\n
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True to their Triple-i philosophy of \u201cInvent\u201d, \u201cInnovate\u201d and \u201cImplement\u201d, their core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields.<\/p>\n
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Core technologies<\/strong><\/p>\n MLE\u2122 – Maskless Exposure Technology<\/a> Nanoimprint Lithography (NIL) – SmartNIL\u00ae<\/a> Wafer-Level Optics<\/a> Optical Lithography<\/a><\/p>\n The most complete technology portfolio, supporting a maximum range of requirements in optical lithography<\/p>\n Resist Processing<\/a> IR LayerRelease\u2122 Technology<\/a> Temporary Bonding and Debonding<\/a> Eutectic Bonding<\/a> Transient Liquid Phase (TLP) Bonding<\/a> Anodic Bonding<\/a> Metal Diffusion Bonding<\/a> Fusion and Hybrid Bonding<\/a> Die-to-Wafer Fusion and Hybrid Bonding<\/a>
\nMoving beyond traditional mask-based lithoghraphy toward digital lithography technology<\/p>\n
\nA large-area soft UV-nanoimprint lithography process for high-volume manufacturing<\/p>\n
\nMarket-leading WLO manufacturing portfolio, including step-and-repeat mastering, lens molding, nanoimprint lithography and stacking<\/p>\n
\nResist processing technology together with patterning are the most repeated steps in semiconductor manufacturing<\/p>\n
\nIR LayerRelease\u2122 Technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking<\/p>\n
\nTemporary bonding and debonding enabling backside processing for 3D integration<\/p>\n
\nEutectic wafer bonding for reliable hermetic sealing<\/p>\n
\nLow-temperature metal wafer bonding by Transient Liquid Phase (TLP)<\/p>\n
\nAnodic bonding for interlayer-free Si-glass bonding<\/p>\n
\nMetal diffusion bonding for precise interfaces and alignment<\/p>\n
\nFusion and Hybrid Bonding for engineered substrates and 3D device integration<\/p>\n
\nCollective and direct-placement die-to-wafer bonding<\/p>\n