New ultra-compact platform adds in-situ resist thickness metrology, wafer edge exposure and EVG\u00ae150-class performance in a smaller-scale, highly flexible format<\/p>\n
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EV Group (EVG),<\/strong> a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, unveiled the next-generation EVG\u00ae120 automated resist processing system<\/strong> \u2014 a major update to one of the company\u2019s leading coater\/developer platforms. Incorporating a new compact architecture, breakthrough capabilities, and design enhancements leveraged from the widely adopted EVG\u00ae150 system, the new EVG120 delivers significantly higher throughput, greater flexibility, and improved process control compared to the previous generation. It does all this in a smaller footprint optimized for customers with a high mix of products and resist processes that demand maximum flexibility. <\/p>\n New Platform, Expanded Capabilities
\nIdeal for advanced packaging, MEMS, image sensors, photonics, power devices, wafer probe cards, and other fast-growing application areas, the next-generation EVG120 supports spin coating, spray coating and developing of photoresist materials used in photolithography. It accommodates a wide range of substrate types and sizes (from 2 inches up to 200 mm), and supports a variety of resist materials, including thin, thick, positive tone and negative tone, dielectric materials such as PI and PBO, as well as black\/color\/IR resists for specialty applications.<\/p>\n
\nThe EVG120 has been redesigned around a compact 200-mm platform that integrates up to two wet processing modules and 14 bake\/chill plates \u2014 a 40-percent increase in capacity over the previous-generation platform. The system\u2019s footprint has also been reduced by more than 20 percent, while design improvements enable easier access for tool maintenance and flexible modular configuration.
\nThe system also introduces multiple new capabilities not available on earlier generations, including:
\n\u2022 Wafer Edge Exposure (WEE) \u2013 enables selective edge exposure for improved edge accuracy and uniformity
\n\u2022 In-situ Resist Thickness Measurement \u2013 enables real-time process monitoring for improved yield and process control (measurement range: 50 nm to 50 micron)
\n\u2022 Enhanced High-Viscosity Dispense System \u2013 high-pressure dispensing with closed-loop feedback provides precision coating performance on thick photoresists
\n\u2022 Support for SMIF Loadports \u2013 enables cleaner and more efficient material handling
\n\u2022 Stand-by Mode \u2013 reduces energy consumption during idle periods; supports SEMI E167 compliance
\nThese additions build upon EVG\u2019s proven coating technologies such as its innovative CoverSpin\u2122 bowl design, which provides superior uniformity and reduces material consumption, and its proprietary OmniSpray\u00ae conformal spray coating technology, which provides optimal coating of surfaces with severe topographies and fragile substrates.<\/p>\n