Thank you for visiting our stand at Evertiq Expo.
\nIt was a pleasure to meet you and discuss topics related to wire bonding that are important to you.<\/p>\n
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The wire bonders from F&S Bondtec are flexible in their application and testify to the highest quality. Thanks to years of experience and proven technologies, the wire bonders of F&S Bondtec are always able to meet the high demands of its customers. For many years, the company has been characterized by its innovative strength and customer orientation. The wire bonders from F&S Bondtec offer the best quality and an unbeatable price-performance ratio. Characteristic of all their wire bonders are quick and easy changeable bondheads to support all necessary bonding processes. Equally important is an intuitive software that optimally supports the bonding process and thus enables the best possible result.<\/p>\n
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F&S Bondtec is the global market and technology leader in bond testing. From manual testers for quick tests, or fully automated solutions for low costs, F&S Bondtec offers the right solution for every requirement. No matter which solution you choose, each machine from F&S Bondtec comes with specially developed software. The intuitive user interface lets you create automatically generated reports in record time. The revolutionary BAMFIT test procedure is unique in the world. A special test head makes it easy to install on any 56XX series base unit.<\/p>\n
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The product portfolio of F&S Bondtec also includes special machines. F&S Bondtec offers its customers individual solutions, which include services from the feasibility study through to production. Product training takes place regularly at the training center in Braunau am Inn.<\/p>\n","protected":false},"excerpt":{"rendered":"
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