PC controlled Manual Die Bonder
\nThe T-5100 is the successor of the proven and well known T-3000-M series with many features of the PRO-series. It is an universal workhorse for a wide range of micro-assembly tasks. The manual operation makes it so very flexible and adaptable to many tasks in the R&D area, and it is just as popular for small-scale and pilot production.
\nThe extremely rigid machine, with its completely redeveloped base is compact and fits on a lab desk. It can be expanded with many different modules to cover an enormous range of applications.<\/p>\n
Operating a Tresky die bonder\/placer is intuitive. A few minutes\u2019 training is sufficient to start working with the machine. The accuracy and repeatability of placing parts is superb thanks to a number of wellthought out features like a true, linear Z-Axis, Force Control, XY Fine Control and high-resolution optics that allow flip-chip placing down to sub-micron accuracy.<\/p>\n
T-5100-W
\nPC controlled Manual Die Bonder
\nUnique pick-up from wafer
\nThe T-5100-W version features the same flexibility than the T-5100 and has the additional advantage of handling wafers, which sits below the main table with Tresky\u2019s pneumtatic die ejection system.
\nThe systems can run all basic functions as well as the industries most advanced applications by adding a wide range of available options. As with all of Tresky\u2019s products, the T-5100-W incorporates True Vertical Technology\u2122 which guarantees parallelism between chip and substrate at any bond height. Together with superior ergonomics the platform is the industry\u2019s most sophisticated system in its class and with the new intuitive software even easier to operate.<\/p>\n
Typical and customized Applications
\nDie sorting from wafer into waffle packs or gel packs
\nDie attach with adhesive (stamped or dispensed)
\n3D packaging of MEMS, MOEMS, Photonics, …
\nHigh-precision placement with visual adjustment by beam-splitter unit for look-up inspection of edges, corners or patterns, e.g. for laser bars
\nFlip-Chip with ultrasonic die attach
\nFlip-Chip with adhesives or anisotropic foils
\nSensor assembly
\nUV curing of die attach
\nEutectic bonding of AuSi, Copper Pillar and others<\/p>\n","protected":false},"excerpt":{"rendered":"
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