{"id":1798,"date":"2023-04-14T15:15:05","date_gmt":"2023-04-14T13:15:05","guid":{"rendered":"https:\/\/prokon-elektronika.pl\/?post_type=product&#038;p=1798"},"modified":"2023-04-14T15:15:06","modified_gmt":"2023-04-14T13:15:06","slug":"die-bonder-t-5300","status":"publish","type":"product","link":"https:\/\/prokon-elektronika.pl\/en\/katalog\/wire-bonders-and-die-bonders\/die-bonder-t-5300\/","title":{"rendered":"Die bonder T-5300"},"content":{"rendered":"<p>T-5300<br \/>\nManual and semi-automatic die bonder with motorized and programmable Z-axis, with True Vertical Technology\u2122, making it extremely useful for repetitive processes in small-scale production where operator influence must be minimized. The T-5300 is suitable for applications requiring the highest precision, such as flip-chip or eutectic bonding. An optional high-resolution beam splitter unit provides sub-micron placement accuracy.<br \/>\nT-5300-W<br \/>\nWafer Handling capability<br \/>\nManual and semi-automatic die bonder with wafer handling capability.<br \/>\nThe T-5300-W version offers the same flexibility as the T-5300, with the added benefit of being able to pick up structures from silicon wafers up to 200mm with the Tresky electric ejector located under the main table. The system has all the basic functions to support the most advanced applications in the industry. To this can be added a wide range of available options. Like all Tresky products, the T-5300-W features True Vertical Technology\u2122, which guarantees parallelism between the chip and the ground at any connection height. In addition to excellent ergonomics, the platform is the most advanced system in the industry in its class, and thanks to the new, intuitive software, it is even easier to use.<\/p>\n<p>Typical and customized applications<br \/>\n\u2022 Die sorting from wafer into waffle packs or gel packs<br \/>\n\u2022 Die attach with adhesive (stamped or dispensed)<br \/>\n\u2022 3D packaging of MEMS, MOEMS, VCSEL, Photonics, &#8230;<br \/>\n\u2022 High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of edges, corners or patterns, e.g. for laser bars<br \/>\n\u2022 Flip-Chip with ultrasonic die attach<br \/>\n\u2022 Flip-Chip with adhesives or anisotropic foils<br \/>\n\u2022 Sensor assembly<br \/>\n\u2022 UV curing of die attach<br \/>\n\u2022 Eutectic bonding of AuSi, Copper Pillar and others<br \/>\n\u2022 Ultrasonic bonding on a curved surface<\/p>\n","protected":false},"excerpt":{"rendered":"<p>Manual and semi-automatic die bonder with motorized and programmable Z-axis<\/p>\n","protected":false},"featured_media":1797,"template":"","meta":[],"class_list":["post-1798","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-wire-bonders-and-die-bonders","product_tag-electromobility","product_tag-microassembly","product_tag-semiconductor-electronics","product_tag-thick-film-hybrids-and-ltcc","pa_producent-dr-tresky-en"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product\/1798","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/1797"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=1798"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}