T-6000-L Flexible Automatic Die Bonder<\/b><\/p>\n
The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.<\/span><\/p>\n Equipped with linear motors and 0.1 ?m resolution glass scales, this enables a movement precision of 8 ?m @ 3Sigma. A force range of 15 g up to 800 g, combined with the large working area of 495 mmx 400 mm and wafer handling up to 8?, offers a wide range of applications.<\/span><\/p>\n With numerous available options, the T-6000-L can be customized to best suit all market needs.<\/span><\/p>\n <\/p>\n T-6000-L\/G Flexible High Precision Automatic Die Bonder<\/b><\/p>\n The T-6000-L\/G is an enhanced version of the proven T-6000-L series. A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L\/G can be upgraded with new loader and unloader modules. The throughput for the latest advanced packaging applications has been extremely improved. With numerous available options, the T-6000-L\/G can be customized to suit all market needs. This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes. Just a few software clicks will guide you through this process.<\/span><\/p>\n <\/p>\n T-8000-G Flexible Automatic Die Bonder<\/b><\/p>\n The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite gantry.<\/span><\/p>\n Developed for a higher throughput and more accuracy, best fit for medium sized production.<\/span><\/p>\n This platform offers a large working area especially for 12? wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.<\/span><\/p>\n","protected":false},"excerpt":{"rendered":" T-6000-L Flexible Automatic Die Bonder<\/b><\/p>\n The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.<\/span><\/p>\n Equipped with linear motors and 0.1 ?m resolution glass scales, this enables a movement precision of 8 ?m @ 3Sigma. A force range of 15 g up to 800 g, combined with the large working area of 495 mmx 400 mm and wafer handling up to 8?, offers a wide range of applications.<\/span><\/p>\n With numerous available options, the T-6000-L can be customized to best suit all market needs.<\/span><\/p>\n","protected":false},"featured_media":608,"template":"","meta":[],"class_list":["post-937","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-wire-bonders-and-die-bonders","product_tag-electromobility","product_tag-microassembly","product_tag-semiconductor-electronics","product_tag-thick-film-hybrids-and-ltcc","pa_producent-tresky-automation-en"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product\/937","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/608"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=937"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}