{"id":959,"date":"2021-03-11T14:09:23","date_gmt":"2021-03-11T13:09:23","guid":{"rendered":"http:\/\/prokon-elektronika.pl\/katalog\/uncategorized\/58xx-bonder-drutowy\/"},"modified":"2021-03-23T15:23:31","modified_gmt":"2021-03-23T14:23:31","slug":"58xx-wire-bonder","status":"publish","type":"product","link":"https:\/\/prokon-elektronika.pl\/en\/katalog\/wire-bonders-and-die-bonders\/58xx-wire-bonder\/","title":{"rendered":"58xx wire bonder"},"content":{"rendered":"

58xx series<\/span><\/p>\n

A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.<\/span><\/p>\n

Fully automatic wire bonding with manual parts feeding<\/span><\/p>\n

Digital ultrasonic generator provides adjustable bond frequencies<\/span><\/p>\n

Store an unlimited number of bond programs<\/span><\/p>\n

Extremely adaptable bond settings, loop shapes, force and power profiles etc.<\/span><\/p>\n

Most powerful pattern recognition system on the market<\/span><\/p>\n

Deformation Limit Control (DLC) for real-time quality checks<\/span><\/p>\n

Innovative software<\/span><\/p>\n

From single bonds to complex programs.<\/span><\/p>\n

The device fits perfectly into the medium scale of production.<\/span><\/p>\n

Exchangeable bond heads for all wire bond processes:<\/span><\/p>\n

5810<\/b>\u00a0<\/span><\/p>\n

Gold-Ball bonding for wires from 12,5 to 50 ?m\u00a0<\/span><\/p>\n

Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces<\/span><\/p>\n

Bumping, safety-bump, stitch-on-ball<\/span><\/p>\n

5830<\/b>\u00a0<\/span><\/p>\n

Wegde-wedge bonding for aluminum and gold wirdes from 17,5 to 75 ?m\u00a0<\/span><\/p>\n

45\u00b0 wire guide. convertible to 30\u00b0 or 60\u00b0 ? depending on compontent geometry<\/span><\/p>\n

5832<\/b>\u00a0<\/span><\/p>\n

Deep Access Wedge-Wedge bonding for aluminum and gold wires from 17.5 to 75 ?m<\/span><\/p>\n

90\u00b0 wirde guide\u00a0<\/span><\/p>\n

Perfect for difficult and constricted bonding geometries<\/span><\/p>\n

Ideally suited for aluminum and gold ribbons<\/span><\/p>\n

5850<\/b>\u00a0<\/span><\/p>\n

Heavy wire bonding for aluminum wire from 100 up to 500 ?m diameter<\/span><\/p>\n

Heavy wire bonding for copper wire from 100 up to 300 ?m diameter<\/span><\/p>\n

for power devices, currents up to 50 A<\/span><\/p>\n

5850 HR<\/b>\u00a0<\/span><\/p>\n

Heavy Ribbon bonding for aluminum ribbons up to 2 mm width<\/span><\/p>\n

Increased programmable bond force up to 6,000 cN<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"

A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.<\/span><\/p>\n","protected":false},"featured_media":538,"template":"","meta":[],"class_list":["post-959","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-wire-bonders-and-die-bonders","product_tag-electromobility","product_tag-microassembly","product_tag-nanotechnology","product_tag-photovoltaics","product_tag-semiconductor-electronics","product_tag-thick-film-hybrids-and-ltcc","pa_producent-fs-bondtec-semiconductor-gmbh-en"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product\/959","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/538"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=959"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}