Series 56i – Fully automatic bonding with manual part feeding universal devices – making wire connections and testing in one device, as well as interchangeable bondheads for all wirebond and testing process, with it, it is possible to switch between different applications within minutes.
\nUnbeatable flexibility
\nExtremely adaptable bond settings, loop shapes, force and power profiles etc.
\nStore an unlimited number of bond programs
\nMost powerful pattern recognition system on the market
\nInnovative and intuitive programmable software
\n6 in 1, all 56i series machines are based on one platform. This means they can be used in a modular way by replacing the heads for all bonding processes: from thin wire to thick wire, ribbon to thick ribbon; technology of wedge-wedge, ball and deep-access connections.
\nThe series includes:
\n– 5610i ? Gold-Ball
\nGold-Ball bonding for wires from 12 to 50 ?m using standard capillaries 16 mm to 19 mm
\n5630i ? Thin Wire Wedge-Wedge
\nWegde-wedge bonding using 1? tools for aluminum and gold wirdes from 12 to 75 ?m strength
\n45\u00b0 wire guide. convertible to 30\u00b0 or 60\u00b0 ? depending on compontent geometry
\n5632i ? Thin Wire Deep Access
\nDeep Access Wegde-Wedge bonding using 1? or 3\/4? tools
\n90\u00b0 wire guide for aluminum and gold wirdes from 12 bis 75 ?m
\nPerfect for difficult and constricted bonding geometries
\nIdeally suited for aluminum and gold ribbons
\n5650i ? Heavy Wire
\nHeavy wire bonding for aluminum from 100 up to 500 ?m diameter
\nHeavy wire bonding for copper wire from 100 up to 300 ?m diameter
\nWedge lengths of 50 up to 70 mm even for extreme bonding requirements
\n5650i HR ? Heavy Ribbon
\nHeavy Ribbon bonding for aluminum ribbons up to 2 mm width
\nIncreased programmable bond force up to 6,000 cN, also with force and power ramps
\nActive ribbon guide to improve loop shaping
\n– 5600Ci ? Automatic Pull- & Shear Tester
\nTest heads with exchangeable cartridges<\/p>\n