{"id":964,"date":"2021-03-11T13:58:21","date_gmt":"2021-03-11T12:58:21","guid":{"rendered":"http:\/\/prokon-elektronika.pl\/katalog\/uncategorized\/evg510-system-bondowania-plytek-krzemowych\/"},"modified":"2021-03-23T15:27:10","modified_gmt":"2021-03-23T14:27:10","slug":"evg510-wafer-bonding-system","status":"publish","type":"product","link":"https:\/\/prokon-elektronika.pl\/en\/katalog\/wafer-bonders\/evg510-wafer-bonding-system\/","title":{"rendered":"EVG510 Wafer bonding system"},"content":{"rendered":"<p><span style=\"font-weight: 400;\">Wafer bonding system for R&amp;D or low-volume production &#8211; fully compatible with high-volume-manufacturing equipment<\/span><\/p>\n<p><span style=\"font-weight: 400;\">The EVG510 is a highly flexible wafer bonding system that can handle substrate sizes from pieces to 200 mm. This tool supports all common wafer bonding processes such as anodic, glass frit, solder, eutectic, transient liquid phase, and direct. The easy access bond chamber and tooling design allows for quick and easy retooling for different wafer sizes and processes with a conversion time of less than 5 minutes. This versatility is ideal for universities, R&amp;D facilities, or low-volume production applications. The design of the bond chambers is the same on the EVG high-volume-manufacturing tools, such as the EVG GEMINI, and the bonding recipes are easily transferable, allowing for easy scale up of production volumes.<\/span><\/p>\n<p>&nbsp;<\/p>\n<p><span style=\"font-weight: 400;\">All of the features of the EVG?501\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Single chamber system for up to 150 mm and 200 mm wafers\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Lowest cost-of-ownership for R&amp;D and pilot-line production\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Unmatched pressure and temperature uniformity\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">High yield through automatic wedge compensation\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Recipe compatible to EVG HVM bonding systems\u00a0<\/span><\/p>\n<p><span style=\"font-weight: 400;\">High throughput with fast heating and pumping specifications<\/span><\/p>\n","protected":false},"excerpt":{"rendered":"<p><span style=\"font-weight: 400;\">Wafer bonding system for R&amp;D or low-volume production &#8211; fully compatible with high-volume-manufacturing equipment<\/span><\/p>\n","protected":false},"featured_media":810,"template":"","meta":[],"class_list":["post-964","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-wafer-bonders","product_tag-nanotechnology","product_tag-semiconductor-electronics","pa_producent-evgroup-en"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product\/964","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/810"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=964"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}