{"id":968,"date":"2021-03-11T13:55:14","date_gmt":"2021-03-11T12:55:14","guid":{"rendered":"http:\/\/prokon-elektronika.pl\/katalog\/uncategorized\/evg105-modul-wygrzewajacy\/"},"modified":"2021-03-23T15:29:56","modified_gmt":"2021-03-23T14:29:56","slug":"evg105-bake-module","status":"publish","type":"product","link":"https:\/\/prokon-elektronika.pl\/en\/katalog\/devices-for-photolithography\/evg105-bake-module\/","title":{"rendered":"EVG105 Bake module"},"content":{"rendered":"<p><span style=\"font-weight: 400;\">The stand-alone EVG<\/span><span style=\"font-weight: 400;\">?<\/span><span style=\"font-weight: 400;\">105 bake module is designed for soft- or post-exposure bake processes.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Soft bake, post-exposure bake and hard bake processes can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles. The EVG105 bake module can process up to 300 mm wafer sizes or up to four 100 mm wafers at the same time.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">Features<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Stand-alone bake module<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Up to 300 mm wafer size or up to four 100 mm wafers at the same time<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Temperature uniformity ? ? 1 \u00b0C @ 100 \u00b0C, up to 250 \u00b0C bake temperature\u00a0<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Loading pins for manual and safe wafer loading\/unloading<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Timer for bake<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Substrate vacuum (direct contact bake)<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">N<\/span><span style=\"font-weight: 400;\">2<\/span><span style=\"font-weight: 400;\">\u00a0purge and proximity bake 0-1 mm distance wafer to heat plate optional<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">Irregular shaped substrates<\/span><\/li>\n<\/ul>\n","protected":false},"excerpt":{"rendered":"<p><span style=\"font-weight: 400;\">The stand-alone EVG<\/span><span style=\"font-weight: 400;\">?<\/span><span style=\"font-weight: 400;\">105 bake module is designed for soft- or post-exposure bake processes.<\/span><\/p>\n","protected":false},"featured_media":798,"template":"","meta":[],"class_list":["post-968","product","type-product","status-publish","has-post-thumbnail","hentry","product_cat-devices-for-photolithography","product_tag-material-engineering","product_tag-nanotechnology","product_tag-semiconductor-electronics","pa_producent-evgroup-en"],"_links":{"self":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product\/968","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/product"}],"about":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/types\/product"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media\/798"}],"wp:attachment":[{"href":"https:\/\/prokon-elektronika.pl\/en\/wp-json\/wp\/v2\/media?parent=968"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}