New Tresky T-5500 High Force Die Bonder & Component Placer

NEW, 1000N High Force Die Bonder with intigrated compensations frame. Programmable Z-axis and new motorized Theta-axis (spindle rotation).

 

Tresky’s T-5500  adds a High Force Machine to the line of the T-5100 and T-5300. The sophisticated design of the integrated HF-module, up to 100Kg, in combination with the Tresky True Vertical Technology ensures an absolute coplanarity between chip and substrate at any height and force during the bonding process.This state-of-the-art machine is designed to meet the most demanding requirements of our industry.

 

With its advanced capabilities, the T-5500 High Force Die Bonder ensures superior performance, efficiency, and reliability. Whether you’re working with Sinter, Large Devices or challenging projects, this machine is the perfect solution to elevate your process.