Welcome to my webpage. PROKON company deals with the promotion, markieting and sales assistance in technological equipment and materials for scientific research and production in the area of electronics and other fileds. I warmly invite you to familiarize with the offer.
Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This…
Platform incorporates newly designed high-force bond chamber that ensures excellent bond quality and yield across larger wafer surfaces EV Group (EVG), a leading provider of…
In the dynamic world of optoelectronics, where light and electronics come together, the connection technology plays a crucial role for the performance and lifespan of…
