Welcome to my webpage. PROKON company deals with the promotion, markieting and sales assistance in technological equipment and materials for scientific research and production in the area of electronics and other fileds. I warmly invite you to familiarize with the offer.
The EVG®880 LayerRelease™ system from Austrian company EVGroup is a fully automated, next-generation platform for the transfer of thin semiconductor layers in high-volume production (HVM)….
The Tresky T-200 is a precision die bonding platform designed for photonics, MEMS, semiconductor and sensor packaging applications. Its flexibility and accuracy make it ideal…
Maximum flexibility with a working area of 480 x 700 mm for a wide range of applications; Upgradeable to a fully automatic bond tester; Interchangeable…
