Tresky offers a wide range of application options for ultrasonic DIE bonding

Ultrasonic DIE bonding is a fast, clean and efficient technology increasingly utilized in the semiconductor industry for the assembly of heat sensitive microelectronic DIE’s. This method leverages high-frequency ultrasonic vibrations to create a reliable bonds between semiconductor DIEs and substrates, significantly reducing thermal stress. The advantages of ultrasonic DIE bonding include rapid processing times, low temperatures and excellent mechanical strength, making it particularly suitable for advanced applications such as RF components, MEMS and LED packaging.
https://www.tresky.de/en/news-en/tresky-offers-a-wide-range-of-application-options-for-ultrasonic-die-bonding/