EVG Technologies
For nearly 40 years, EVG has provided industry-leading process technologies and solutions that have enabled innovations in advanced packaging, optics and photonics, sensors and bio-medical devices and applications.
True to their Triple-i philosophy of “Invent”, “Innovate” and “Implement”, their core lithography, wafer bonding and metrology technologies enable manufacturers to develop the latest micro- and nanotechnology device breakthroughs, and then bring them into high-volume production, cost effectively and at high process yields.
Core technologies
MLE™ – Maskless Exposure Technology
Moving beyond traditional mask-based lithoghraphy toward digital lithography technology
Nanoimprint Lithography (NIL) – SmartNIL®
A large-area soft UV-nanoimprint lithography process for high-volume manufacturing
Wafer-Level Optics
Market-leading WLO manufacturing portfolio, including step-and-repeat mastering, lens molding, nanoimprint lithography and stacking
The most complete technology portfolio, supporting a maximum range of requirements in optical lithography
Resist Processing
Resist processing technology together with patterning are the most repeated steps in semiconductor manufacturing
IR LayerRelease™ Technology
IR LayerRelease™ Technology enables nanometer-precision layer transfer through silicon, eliminating glass substrates for advanced packaging and enabling thin-layer 3D stacking
Temporary Bonding and Debonding
Temporary bonding and debonding enabling backside processing for 3D integration
Eutectic Bonding
Eutectic wafer bonding for reliable hermetic sealing
Transient Liquid Phase (TLP) Bonding
Low-temperature metal wafer bonding by Transient Liquid Phase (TLP)
Anodic Bonding
Anodic bonding for interlayer-free Si-glass bonding
Metal Diffusion Bonding
Metal diffusion bonding for precise interfaces and alignment
Fusion and Hybrid Bonding
Fusion and Hybrid Bonding for engineered substrates and 3D device integration
Die-to-Wafer Fusion and Hybrid Bonding
Collective and direct-placement die-to-wafer bonding
ComBond® High-vacuum Wafer Bonding Technology
A breakthrough technology driving the bonding of “anything on anything” enabling emerging and “beyond CMOS” device designs
Process control and optimization for lithography and bonding