F&S BONDTEC wins 2nd Place at the Productronica Innovation Award 2025!

We are proud to announce that F&S BONDTEC has been awarded 2nd Place at the prestigious Productronica Innovation Award 2025 – right in the year the world’s leading trade fair celebrates its 50th anniversary!

 

About the Innovation
They received this recognition for their development of a functional 3D wire bonder for thin-wire applications – an innovation that sets new standards in flexibility, precision, and application possibilities.
Key features:
• A new rotational and tilting axis
• Full synchronization of all machine axes
• Support for complex 3D bonding geometries

This breakthrough enables entirely new use cases in advanced packaging, sensor integration, and microelectronics, making their systems ready for the challenges of tomorrow.

 

Project Support
The development of this next-generation system was made possible through support from the FFG Österreichische Forschungsförderungsgesellschaft mbH – Austrian Research Promotion Agency, whose commitment to innovation and high-tech development they gratefully acknowledge.