EVG established the Heterogeneous Integration Competence Center?
EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets established the Heterogeneous Integration Competence Center?, which is designed to assist customers in leveraging EVG?s process solutions and expertise to enable new and enhanced products and applications driven by advances in system integration and packaging. These include solutions and applications for high-performance computing and data centers, the Internet of Things (IoT), autonomous vehicles, medical and wearable devices, photonics and advanced sensors.
The Heterogeneous Integration (HI) Competence Center combines wafer bonding, thin-wafer handling, and lithography products and expertise, as well as pilot-line production facilities and services at its state-of-the-art cleanroom facilities at EVG?s headquarters in Austria, supported by EVG?s worldwide network of process technology teams. Through the HI Competence Center, EVG will help customers to accelerate technology development, minimize risk, and develop differentiating technologies and products through heterogeneous integration and advanced packaging all while guaranteeing the highest IP protection standards that are required for working on pre-release products.
More information on EVG webpage: