EVG Rolls Out Maskless Lithography for High-volume Manufacturing

LITHOSCALE addresses lithography needs for markets and applications that require a high degree of flexibility or product variation, including advanced packaging, MEMS, biomedical and IC substrate manufacturing.

LITHOSCALE? is a revolutionary, highly versatile maskless exposure lithography platform geared for a variety of microfabrication applications accommodating wafers up to 300 mm.

The LITHOSCALE system featuring EV Group?s MLE? maskless exposure technology  https://www.evgroup.com/technologies/mle-maskless-lithography/  tackles legacy bottlenecks by combining powerful digital processing that enables real-time data transfer and immediate exposure, high structuring resolution and throughput scalability. Its mask-free approach eliminates mask-related consumables, while the exposure system with its tunable solid-state laser source is designed for high redundancy and long life-time stability with unique auto-calibration capabilities that minimize maintenance. Powerful real-time digital processing enables immediate exposure from the design-file to the substrate ? thereby avoiding hours of conversion time for each digital mask layout.  LITHOSCALE features high-resolution (<2?m L/S), dynamically die-level addressable exposure of the entire substrate surface, which enables agile consumable-free processing and low cost of ownership (CoO). The LITHOSCALE system integrates full-wafer top-and-backside alignment utilizing dedicated objectives with visible and IR capability and proprietary chuck designs accommodating wafer sizes up to 300 mm. The system features dynamic alignment modes with an automatic focus, in order to adapt to the substrate material and surface variations. The ability to finely control focus level position keeps sidewalls steep as well as desired 3D contour of the resist, while preventing edge topping and footing. Large working distance and automatic adaptive focus ensures patterning uniformity across the exposure surface. It also offers individualized die processing capability, while fast full-field positioning and dynamic alignment enable high scalability for a range of substrate sizes and shapes.