F&S Bondtec Semiconductor www.fsbondtec.at celebrates their 25th anniversary!

The next PRODUCTRONICA trade fair will take place from 12.11-15.11.19 in Munich.

The F&S Bondec company invites you to visit their booth: Hall B2 / Booth 434.

You will see various wire bonders. The latest trends in the world in wire bonding and connection testing will be presented.

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The company invites you to jointly celebrate their anniversary on 13.11.2019 from 18:00 at the Productronica fair.

More information:

 https://www.fsbondtec.at/we-are-celebrating-our-25th-anniversary-at-the-productronica-in-munich/?lang=en