Microelectronics for military lead: Tresky presents robust DIE bonding and fiber optic technologies for modern defense systems

With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing. Tresky GmbH, a leading provider of precision solutions for semiconductor assembly, specifically addresses the performance requirements of the security and defense industry with its DIE bonder systems and manufacturing services