The transition from wedge-wedge wire bonding to ball bonding: A technical overview.

While wedge-wedge bonding is effective, it has its limitations in applications with finer pitches and certain materials. Moving to ball bonding offers more flexibility and reliability, especially for modern semiconductor packages.
Key considerations in this transition include equipment compatibility and process optimization. Bondtec experts demonstrate the intricacies of tool adaptation and how it is possible to use both technologies at the highest quality with a quick changeover on our 53XXBDA.

SERIES 53 redefines the standards in manual wire bonding by combining state-of-the-art technology with world-class software. With its precision, reliability and versatility, SERIES 53 sets a new benchmark in the industry and enables our customers to take their development processes to the next level.
The video posted on Linkedin illustrates the seamless transition from wedge-wedge wire connection to ball bonding applications.
https://www.linkedin.com/posts/f-s-bondtec_fsbondtec-wirebonder-bondtester-activity-7193950296602013697-kD5j?utm_source=share&utm_medium=member_desktop
The video offers a variety of insights into the diverse possibilities of the SERIES 53