F&S Bondtec Semiconductor supports AGH Racing!
The Bondtec team, a leading manufacturer of wire bonders and specialist in battery bonding, repaired AGH Racing high-voltage battery packs, and thanks to this, the…
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Microelectronics for military lead: Tresky presents robust DIE bonding and fiber optic technologies for modern defense systems
With the increasing digitization and automation of military systems, the demands on electronic assemblies in terms of resilience, miniaturization, and electromagnetic interference immunity are growing….
“Automatic Remanufacturing Wire Bonded Battery Modules: 80% of cells can start a second life.”
F&S Bondtec Semiconductor at The Battery Show Europe 2025 in Stuttgart, June 3-5, 2025 F&S BONDTEC, leading producer of wire bonders and pull/shear testers,…