EV Group Achieves Die-to-Wafer Fusion and Hybrid Bonding Milestone with 100-Percent Die Transfer Yield on Multi-Die 3D System-On-A-Chip

Successful full-system die-to-wafer transfer at EVG’s Heterogeneous Integration Competence Center™ demonstrates important step forward in achieving process maturity
EV Group (EVG), a leading provider of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, announced it has achieved a major breakthrough in die-to-wafer (D2W) fusion and hybrid bonding by successfully demonstrating 100-percent void-free bonding yield of multiple die of different sizes from a complete 3D system-on-a-chip (SoC) in a single transfer process using EVG’s GEMINI®FB automated hybrid bonding system. Such an accomplishment had been a key challenge for D2W bonding until today, as well as a major hurdle to scaling down the cost of implementing heterogeneous integration. This important industry achievement was carried out at EVG’s Heterogeneous Integration Competence Center™ (HICC), which is designed to assist customers in leveraging EVG’s process solutions and expertise to accelerate the development of new and differentiating products and applications driven by advances in system integration and packaging.
For more information on EVG’s Heterogeneous Integration Competence Center (HICC), please visit: https://www.evgroup.com/products/process-services/heterogeneous-integration-competence-center/.