Bondtec at InterNanoPoland in Katowice
Stefan Berger from F&S Bondtec Semiconductor will be together with the 53xxBDA wire bonder at the InterNanoPoland conference in Katowice on October 16-17, 2024.
We invite you to meetings!
Stefan Berger from F&S Bondtec Semiconductor will be together with the 53xxBDA wire bonder at the InterNanoPoland conference in Katowice on October 16-17, 2024.
We invite you to meetings!