The new edition of Bondtec bonders 56xx series – Series 56i
It was one of the milestones in our company’s history – F&S BONDTEC is the first and still the only manufacturer to offer a machine that combines bonder and tester in one device – the fully automatic SERIES 56. With it, it is possible to switch between different applications within minutes. That made the SERIES 56 incredibly flexible and extremely popular with our customers. Today we are pleased to be able to introduce the new edition of exactly that – the Series 56i https://www.fsbondtec.at/maschinen/series-56i/?lang=en
What’s new?
A lot – and yet everything stays the same. The new edition of the Series 56 has kept its basic features – high flexibility, combined with unique possibilities. Due to the ever increasing demands on precision and speed, a large number of incremental improvements were made on the hardware side. A new control unit has found its way into the Series 56i. This enables faster and more precise travels, which for the first time, makes extremely fine wires up to 12 ?m bondable on the machine.
Improved Bondhead-Clamping
The bondhead clamping has been also significantly improved and the general machines stiffnes has been increased too. On the one hand, this results in faster and safer head changes and in a better overall performance of the 56i.
Trace-X-ready
Trace-X is a software interface for traceability for the F&S BONDTEC 56i / 58 machines. An embedded Python script is loaded by the Bonderstar software. This code is open and can be customized by you. The software calls defined functions of the Python script and reports corresponding events.
The goal was to offer a process engineer a variety of parameters for analysis, such as e.g. the current status, production data and changes in the program. This information can be particularly helpful to optimize production processes and to find problems in the production line more quickly.
Smooth 3D – Trajectory – Real Positions
Due to the hardware improvements, some improvements were also possible on the software side. Thanks to Smooth 3D – Trajectory, the movement of the head during the bonding process is even smoother and therefore ideal for loop design.
Another result of the perfect interplay of hardware and software is the Intelligent Wire Spool. It regulates the unwinding of the bond wire so that it is always under tension and the coil is unwound in a controlled manner.
In addition to these innovations, there are a number of other improvements. The Series 56i is also compatible with our new bond weight calibration system MCS-20 and comes with the latest Windows 10.