New standards in flexible high precision die-bonding
F&S Bondtec has just announced an advanced die-bonding solution to complement its flexible manual wire-bonding platform. The new 5380 P&P makes die-bonding as simple and precise as wire bonding, while retaining all the flexibility manual die-bonding processes offer.
Ultrasonic supported die-bonding feature
State-of-the-art production processes need innovative ideas and technical approaches to meet the demands of automotive and other advanced industries. Over the last decade, the market has seen a deluge of increasingly advanced die-bonding materials. In addition to functioning as fixing elements, the materials boast advanced features like thermal conductivity, CTE compensation and gap spacing functionality. However, making the most of these advantages means adapting processes to the specific material properties. This is where the 5380 P&P platform?s unique ultrasonic die-bonding feature comes into play. Ultrasonic waves ensure the functional particles added to such advanced die-attach materials are distributed evenly. The result is high-quality components with maximum performance
Making the right choices in manual COB processing
Simplify your COB processes by making elaborate and expensive special tooling history. The 5380 P&P platform can be used with standard tools for die sizes from 0.5 mm to 10 mm. Placement accuracy is akin to that of manual processes, but the advanced operator-assisting features like programmable adjustment heights, laser assisted positioning and high resolution optics guarantee a unique reproducibility. Huge programmable z-axis (maximum travel: 60 mm, resolution: 1 ?m) and y-axis (maximum travel: 8 mm, resolution: 2 ?m) allow very flexible assemblies. Each process step is highlighted on a super-sized 10.4 inch screen that discourages wandering operator attention during assembly.
? Our wire bonding solutions combined with the 5380 P&P take your electronic assembly experience to a whole new level with unique features that no other manual machine can compete with. ? Die-attach is one element in a sum of parts. State-of-the-art COB processing is always the sum of many parts?new die-attach solutions need to be combined with other sophisticated equipment, such as the advanced 53xx series manual wire bonders and even fully automatic table-top 56xx series bonding machines. F&S Bondtec processing environments have a proven record in complex assemblies for medicine, automotive and sensor applications. Has our newsletter sparked a great new idea? Or do you think we?ve missed something? Get in touch and let us know what your manufacturing needs are.