Austrian company F & S Bondtec Semiconductor is placing an innovation in the pull testing market.

A new, high quality wire bond pull tester LAB-TESTER 101 was presented at SMT in Nürnberg.

Small, compact, manual pull tester with the cutting-edge software at a price below 50% of the market price, with short delivery time.
Intuitive user interface
Modern software
Easy to install and commission
Simple to use, not requiring specialized training
Data analysis using a touch screen or advanced CSR software for data analysis

The Lab-tester meets all today’s requirements for a flexible pull tester, and thus offers the highest quality at a low price