Best Practice Guide for the Creation of Battery Packs using Ultrasonic Wire Bonders

Due to increasing inquiries from various industries, F&S Bondtec Semiconductor has compiled a Best Practice Guide for the Creation of Battery Packs using Ultrasonic Wire Bonders. This guide is the first of its kind and focuses on the practical application of wire bonders when creating battery packs. The foundation comes from years of experience in wire bonding and from research and development in battery connection technology.

Currently there are several methods of interconnecting cylindrical cells together to a battery pack. Spot welding, laser welding and wire bonding are the most common interconnection methods in the market. However, we believe ultrasonic wire bonding is the most favorable technology due to its flexibility and high connection quality.
I invite you to read the material:

https://www.fsbondtec.at/best-practice-guide-battery-bonding/?lang=en