DIE Stacking

DIE Stacking is an assembly process in which multiple chips are stacked on top of each other on a substrate. In this case, a pin is also placed on the chip. The connections between substrate, chip and pin are ensured by an adhesive.
This vertical integration allows a compact arrangement of different circuits with different dimensions on the smallest area, which, in addition to saving space, also achieves higher performance in the component, caused by shorter signal paths between the circuits.
You can also find more information on the producer webpage:
https://www.tresky.de/en/applications/