Dr. Tresky at SMTconnect in Nuremberg, May 9-11, 2023

Dr Tresky, manufacturer of manual and semi-automatic die bonders, has a stand at the international SMTconnect exhibition in the areas of development, production, services and applications related to microelectronic assemblies and systems.
Hall 4A, Stand 234
https://smt.mesago.com/nuremberg/en/exhibitor-search.detail.html/dr-tresky-ag.html

Highly flexible, manual and semi automatic Diebonder, Flip-Chip Bonder, Diesorter, Eutectic- as well Ultrasonic/Thermosonic Bonder.