EVG invites to their stand at SEMICON EUROPA 2019

EVG  https://www.evgroup.com/ leading supplier of equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices invites to visit their booth during SEMICON Europe 12.11 ? 15.11.19 in Munich, Booth B1630.

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We encourage you to participate in EVG presentations:

Wednesday, November 13, 11:30 am

Advanced Packaging Conference, ICM Munich, Room 14a
Mechanical Debonding for Ultrathin Chiplet Manufacturing
Elisabeth Brandl, Business Development
https://www.semiconeuropa.org/advanced-packaging-conference-apc

Wednesday, November 13, 04:05 pm

TechARENA 1, Hall B1 – MEMS along the Value Chain
Advanced Black Resist Processing and Optimized Lithographic Patterning for Novel Optical MEMS Devices
Bozena Matuskova, Business Development

https://www.semiconeuropa.org/showfloor-techarena-2019#MEMS%20along%20the%20Value%20Chain