F&S Bondtec Semiconductor at MRW2022 in Gdańsk and 9th Workshop on Physics and Technology of Semiconductor Lasers 2022 in Kraków

The Austrian company F&S Bondtec Semiconductor, a producer of wire bonders, had their tabletop during the 10th Microwave and Radar Week MRW-2022 conference in Gdańsk, and during the 9th Workshop on Physics and Technology of Semiconductor Lasers 2022 conference in Kraków, a poster entitled “A comparison of gold wire ribbon bonding and ball bonding results in quantum cascade lasers” was created as a result of cooperation between Łukasiewicz – the Institute of Microelectronics and Photonics and F&S BONDTEC Semiconductor.