Rework of LED dies using debonding solution from Tresky Automation

In times of limited availability of components and materials, reworking takes on a very special significance. This also applies to LED manufacturing, where irregularities in processed LEDs are immediately visible at first sight.
Reworking faulty or incorrectly placed components is one of the more demanding tasks in electronics production. If the components are particularly small or fragile, this work is even more complex.
LED dies can be easily and successfully removed with a Tresky Automation system in the rework configuration. The removal takes place without damaging adjacent LED dies and affecting the solder and its environment.
For the debonding process the scrubbing function can be used, which has been modified to break the adhesion between the LED die and the solder using the heating temperature. After the LED die is separated from the solder, a tool picks it up.
A new die can then be inserted in the same Tresky Automation machine. Since the die bonding systems are designed for high-precision processes, the entire reworking process of the LED dies is carried out according to the specifications of the semiconductor production and is therefore not only exact, but also controlled and reproducible.

https://www.tresky.de/en/rework-of-led-dies-using-debonding-solution-from-tresky-automation/