Thanks to the offered specialized equipment, it is possible to carry out the following processes and operations:
- layers deposition using the spin / spray method,
- lithography,
- wafer bonding,
- Nano Imprint Lithography,
- electron lithography (EBL) and ion lithography (IBL),
- thermal oxidation / annealing
- diffusion,
- high vacuum encapsulation,
- LPCVD, CVD, PVD,
- processing of photoimagible thick-film pastes,
- LTCC (Low Temperature Coofired Ceramics) technology,
- firing of thick film pastes, LTCC ceramics,
- low-temperature processes,
- heat treatment of metals and ceramics,
- sintering of nuclear fuel pellets,
- metallization of solar cells (drying and firing of contacts, producing an emitter),
- Bumps soldering, reflow soldering,
- screen printing,
- making electrical wire connections (wire bonding),
- placing and bonding of structures (diebonding, flipchip bonding),
- precise cutting of substrates – automatic and manual,
- mixing and deaeration in a planetary mixer of all materials, even those of very high viscosity, without mixing tools,
- rolling materials in a three-roll mill,
- live inspection, taking photos and videos, 2D and 3D measurements, roughness measurement, non-destructive testing on a digital video 3D microscope,
- non-contact measurement of submicron height over long distances, on any type of surface using a confocal white light profilometer, a wide range of measurements: profile and multiprofiles, shapes and forms, flatness, waviness and coplanarity, roughness, structure, defects,