EMPC 2017

On September 10-13th, 2017 at the Warsaw University of Technology there was an international conference EMPC 2017 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE www.empc2017.pl 

The conference was accompanied by an exhibition in which the companies I co-operate with were:
F & S Bondtec Semiconductor www.fsbondtec.at – manufacturer of wire bonders
On the booth there was the latest pull tester – the LAB-TESTER 101.
http://www.fsbondtec.at/en/machine/lab-tester-101-3/
EVGroup www.evgroup.com – producer of machines for photolithography, Nano Imprint Lithography, hot embossing, UV nano imprint, contact micro printing, spin coating, spray coating, cleaning, wafer bonding, mask aligners, baking modules, 

http://www.evgroup.com/documents/brochures/EVG_ProductRange.pdf 
Haikutech www.haikutech.com – LTCC (Low Temperature Coofired Ceramics), printed electronics http://www.haikutech-printedelectronics.com/
Hirox www.hirox-europe.com – Digital video microscopes for inspection, but also with the ability to perform 2D and 3D measurements, profiles, pictures, movies.
On the booth, there was the RH-2000 model and visitors could inspect, test and measure their own samples.