The bonding head or test head together with the innovative Bondstar software are the heart of Bondtec devices.

Central component of Bondtec machines is the bond head or test head. Coupled with their innovative software – Bondstar – they are the heart of their systems.

In addition, the most ingenious thing about our heads is that they can be changed within a minute and thus different processes can be implemented. The machine can either be converted to a different bonding process or, as in the case of the 56i series, to a bond tester (Pull, Shear, BAMFIT). Just as uncomplicated as fast.

Many applications – one machine
With the automatic wire bonders from F&S BONDTEC you get all bonding technologies for in-house production in one device. Suitable for all wire bonding and test processes because of our interchangeable bonding heads.
Read more: https://www.fsbondtec.at/maschinen/series-56i/?lang=en

Bondtester
Bondtec Series 56i is also able to convert into a bond tester. pull tests  , shear tests  or even BAMFIT (Bondtec Accelerated Mechanical Fatigue Interconnect Testing)  are possible without any problems.

After generating a test program and the adjustment, supported by pattern recognition  (PRU), a reproducible and user-independent pulling or shearing on all conceivable components is guaranteed. This process is unique worldwide and is only offered by F&S BONDTEC. It is fully PC-controlled and, with its programmable cross table, can be used to automatically test any number of bonds.
Read more: https://www.fsbondtec.at/portfolio/automatic-bonder-tester-5600c/?lang=en