Description:

T-5300
Manual and semi-automatic die bonder with motorized and programmable Z-axis, with True Vertical Technology™, making it extremely useful for repetitive processes in small-scale production where operator influence must be minimized. The T-5300 is suitable for applications requiring the highest precision, such as flip-chip or eutectic bonding. An optional high-resolution beam splitter unit provides sub-micron placement accuracy.
T-5300-W
Wafer Handling capability
Manual and semi-automatic die bonder with wafer handling capability.
The T-5300-W version offers the same flexibility as the T-5300, with the added benefit of being able to pick up structures from silicon wafers up to 200mm with the Tresky electric ejector located under the main table. The system has all the basic functions to support the most advanced applications in the industry. To this can be added a wide range of available options. Like all Tresky products, the T-5300-W features True Vertical Technology™, which guarantees parallelism between the chip and the ground at any connection height. In addition to excellent ergonomics, the platform is the most advanced system in the industry in its class, and thanks to the new, intuitive software, it is even easier to use.

Typical and customized applications
• Die sorting from wafer into waffle packs or gel packs
• Die attach with adhesive (stamped or dispensed)
• 3D packaging of MEMS, MOEMS, VCSEL, Photonics, …
• High-precision placement with visual adjustment by beam-splitter unit for look-up inspection of edges, corners or patterns, e.g. for laser bars
• Flip-Chip with ultrasonic die attach
• Flip-Chip with adhesives or anisotropic foils
• Sensor assembly
• UV curing of die attach
• Eutectic bonding of AuSi, Copper Pillar and others
• Ultrasonic bonding on a curved surface