Nanotechnology
Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Encapsulation devices
- Dicing saws
- Materials
Product catalog by category - Nanotechnology
30 products
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5600Ci
Automatic bond pull & shear tester ? unique on the world market and patentedCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
56i
56i wire bonder ? unbeatable flexibility combined with unique possibilitiesCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
58xx wire bonder
A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.Category: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
Ceramic substrates
Various types and dimensions of alumina ceramics, blank, scribed according to the customer?s designCategory: Materials
Producer:
Diffusion tube furnace BDF 41
Diffusion tube furnaceCategory: Furnaces
Producer: BTU
eLine Plus
Discover nanoengineering beyond Electron Beam LithographyCategory: Electron beam lithography systems
Producer: Raith GmbH
Elphy
Unlock the full nanopatterning potential of your SEM, FIB-SEM, or HIMCategory: Electron beam lithography systems
Producer: Raith GmbH
EPBG5200 Plus, EPGB 5150 Plus
Shaping the future of nanofabricationCategory: Electron beam lithography systems
Producer: Raith GmbH
EVG101 Advanced resist processing system
Single-wafer resist processing in R&D and small-scale productionCategory: Devices for photolithography
Producer: EVGroup
EVG105 Bake module
The stand-alone EVG?105 bake module is designed for soft- or post-exposure bake processes.Category: Devices for photolithography
Producer: EVGroup
EVG120 Automated resist processing system
The EVG?120 is a compact, cost-effective resist processing system for starting up production when cleanroom space is limited.Category: Devices for photolithography
Producer: EVGroup
EVG20 IR Inspection system
Fast void inspection of bonded wafer stacksCategory: Wafer bonders
Producer: EVGroup
EVG301 Single wafer cleaning system
R&D type single wafer cleaning systemCategory: Wafer cleaners
Producer: EVGroup
EVG40 NT Automated Measurement System
Versatile, high-accuracy metrology for bonding and lithographyCategory: Wafer bonders
Producer: EVGroup
EVG501 Wafer bonding system
Versatile manual wafer bonding system for academia and industrial researchCategory: Wafer bonders
Producer: EVGroup
EVG510 Wafer bonding system
Wafer bonding system for R&D or low-volume production – fully compatible with high-volume-manufacturing equipmentCategory: Wafer bonders
Producer: EVGroup
EVG610 Mask alignment system
The EVG?610 is a compact and multi-purpose R&D system that can handle small substrate pieces and wafers up to 200 mm.Categories: Devices for photolithography, Nanoimprint devices
Producer: EVGroup
EVG620NT/EVG6200NT Mask Alignment System (semi-automated / automated)
Production system for wafer sizes up to 150 mm / 200 mm Proximity wedge error compensationCategories: Devices for photolithography, Nanoimprint devices
Producer: EVGroup
HRX-01- Digital microscope 3D
Digital microscope 3D the latest generation for observation and measurementsCategory: Digital optical microscopes 3D
Producer: Hirox
Laboratory mixer Kakuhunter
The device, by revolution and rotation, performs mixing / kneading and at the same time deaeration in a short time without using mixing tools.Category: Laboratory mixers
Producer: Shashin Kagaku