EVG620NT/EVG6200NT Mask Alignment System (semi-automated / automated)
Production system for wafer sizes up to 150 mm / 200 mm
Proximity wedge error compensation
Handling of multiple wafer sizes with quick changeover time of less than 5 min.
Up to 180 wph first print mode / 140 wph automatic alignment mode
Optional stand-alone version with anti-vibration granite table
Dynamic alignment function featuring real-time offset correction
Supports the latest UV-LED technology
The EVG?620 NT provides state-of-the art mask alignment technology on a minimized footprint area up to 150 mm wafer size.
The EVG?6200 NT mask aligner is a versatile tool for optical double-side lithography and wafer sizes up to 200 mm.