Thick film hybrids and LTCC
Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Encapsulation devices
- Dicing saws
- Materials
Product catalog by category - Thick film hybrids and LTCC
29 products
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53xx
Manual wire bonderCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
5600Ci
Automatic bond pull & shear tester ? unique on the world market and patentedCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
56i
56i wire bonder ? unbeatable flexibility combined with unique possibilitiesCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
58xx wire bonder
A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.Category: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
8600C
Automatic large area Pull- & Shear testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
BAMFIT tester
Tester for heavy wire bond connections as an alternative to the shear testCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
Ceramic substrates
Various types and dimensions of alumina ceramics, blank, scribed according to the customer?s designCategory: Materials
Producer:
Die bonder T-4909-AE
Budget sensitive Manual Die BonderCategory: Wire bonders and die bonders
Producer: Dr Tresky
Die bonder T-5100
PC controlled Manual Die Bonder – an universal device for a wide range of micro-assembly tasks.Category: Wire bonders and die bonders
Producer: Dr Tresky
Die bonder T-5300
Manual and semi-automatic die bonder with motorized and programmable Z-axisCategory: Wire bonders and die bonders
Producer: Dr Tresky
Die bonders T-3002-PRO, T-3000-PRO
High Force Multi Application SystemsCategory: Wire bonders and die bonders
Producer: Dr Tresky
Diebonder T-6000, T-6000-L/G, T-8000-G
T-6000-L Flexible Automatic Die Bonder The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production. Equipped with linear motors […]Category: Wire bonders and die bonders
Producer: Tresky Automation
HP 603 LTCC Sintering Press
Sintering Press for LTCC substrates Low Power consumption 4kW @ 1000°CCategory: Devices for LTCC technology
Producer: ATV Technologie GmbH
HRX-01- Digital microscope 3D
Digital microscope 3D the latest generation for observation and measurementsCategory: Digital optical microscopes 3D
Producer: Hirox
LAB- TESTER 101
LAB-TESTER 101 – high quality wire bond pull testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
Laboratory mixer Kakuhunter
The device, by revolution and rotation, performs mixing / kneading and at the same time deaeration in a short time without using mixing tools.Category: Laboratory mixers
Producer: Shashin Kagaku
NPS (Nano Point Scanner)
The NPS is an innovative non-contact confocal 3D profilometer measuring altitude in real time, for profile or surface scanningCategory: Confocal systems
Producer: Hirox
P series screen printers
The P-series of screen printers are designed for diverse (precise) screen printing applications in electronics production such as: LTCC, HTCC, MLCC, hybrid circuits, sensors, photovoltaics, […]Category: Printers
Producer: Haikutech
P250 series screen printer
Advanced high precision screen printersCategory: Printers
Producer: Haikutech
PEO 601-604 Quartz glass tube process furnaces
Quartz glass tube chamber furnacesCategory: Furnaces
Producer: ATV Technologie GmbH