Description:

T-6000-L Flexible Automatic Die Bonder

The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production.

Equipped with linear motors and 0.1 ?m resolution glass scales, this enables a movement precision of 8 ?m @ 3Sigma. A force range of 15 g up to 800 g, combined with the large working area of 495 mmx 400 mm and wafer handling up to 8?, offers a wide range of applications.

With numerous available options, the T-6000-L can be customized to best suit all market needs.

T-6000-L/G Flexible High Precision Automatic Die Bonder

The T-6000-L/G is an enhanced version of the proven T-6000-L series. A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L/G can be upgraded with new loader and unloader modules. The throughput for the latest advanced packaging applications has been extremely improved. With numerous available options, the T-6000-L/G can be customized to suit all market needs. This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes. Just a few software clicks will guide you through this process.

T-8000-G Flexible Automatic Die Bonder

The T-8000-G Die Bonder is a fully-automated all-purpose system built on a granite gantry.

Developed for a higher throughput and more accuracy, best fit for medium sized production.

This platform offers a large working area especially for 12? wafer handling. Open, with a wide range of applications and numerous available options, the T-8000-G can be customized to best suit all market needs.