F&S Bondtec Semiconductor GmbH
Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Devices for thick film photoimagible pastes
- Encapsulation devices
- Dicing saws
- Materials
Product catalog by producers - F&S Bondtec Semiconductor GmbH
9 products
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53xx
Manual wire bonderCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
5600Ci
Automatic bond pull & shear tester ? unique on the world market and patentedCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
56i
56i wire bonder ? unbeatable flexibility combined with unique possibilitiesCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
58xx wire bonder
A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.Category: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
8600C
Automatic large area Pull- & Shear testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
BAMFIT tester
Tester for heavy wire bond connections as an alternative to the shear testCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
LAB- TESTER 101
LAB-TESTER 101 – high quality wire bond pull testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
Wire bonder series 86xx
Bonders to make electrical connections with thick wire or ribbon.Category: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
