58xx wire bonder
A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8” x 6”.
Fully automatic wire bonding with manual parts feeding
Digital ultrasonic generator provides adjustable bond frequencies
Store an unlimited number of bond programs
Extremely adaptable bond settings, loop shapes, force and power profiles etc.
Most powerful pattern recognition system on the market
Deformation Limit Control (DLC) for real-time quality checks
From single bonds to complex programs.
The device fits perfectly into the medium scale of production.
Exchangeable bond heads for all wire bond processes:
Gold-Ball bonding for wires from 12,5 to 50 µm
Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces
Bumping, safety-bump, stitch-on-ball
Wegde-wedge bonding for aluminum and gold wirdes from 17,5 to 75 µm
45° wire guide. convertible to 30° or 60° – depending on compontent geometry
Deep Access Wedge-Wedge bonding for aluminum and gold wires from 17.5 to 75 µm
90° wirde guide
Perfect for difficult and constricted bonding geometries
Ideally suited for aluminum and gold ribbons
Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter
Heavy wire bonding for copper wire from 100 up to 300 µm diameter
for power devices, currents up to 50 A
Heavy Ribbon bonding for aluminum ribbons up to 2 mm width
Increased programmable bond force up to 6,000 cN