58xx wire bonder

Description:

58xx series

A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8” x 6”.

Fully automatic wire bonding with manual parts feeding

Digital ultrasonic generator provides adjustable bond frequencies

Store an unlimited number of bond programs

Extremely adaptable bond settings, loop shapes, force and power profiles etc.

Most powerful pattern recognition system on the market

Deformation Limit Control (DLC) for real-time quality checks

Innovative software

From single bonds to complex programs.

The device fits perfectly into the medium scale of production.

Exchangeable bond heads for all wire bond processes:

5810 

Gold-Ball bonding for wires from 12,5 to 50 µm 

Highly sensitive, contactless electronic touchdown sensor and digitally controlled, programmable bond force for delicate component surfaces

Bumping, safety-bump, stitch-on-ball

5830 

Wegde-wedge bonding for aluminum and gold wirdes from 17,5 to 75 µm 

45° wire guide. convertible to 30° or 60° – depending on compontent geometry

5832 

Deep Access Wedge-Wedge bonding for aluminum and gold wires from 17.5 to 75 µm

90° wirde guide 

Perfect for difficult and constricted bonding geometries

Ideally suited for aluminum and gold ribbons

5850 

Heavy wire bonding for aluminum wire from 100 up to 500 µm diameter

Heavy wire bonding for copper wire from 100 up to 300 µm diameter

for power devices, currents up to 50 A

5850 HR 

Heavy Ribbon bonding for aluminum ribbons up to 2 mm width

Increased programmable bond force up to 6,000 cN