Microassembly
Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Encapsulation devices
- Dicing saws
- Materials
Product catalog by category - Microassembly
21 products
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53xx
Manual wire bonderCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
5600Ci
Automatic bond pull & shear tester ? unique on the world market and patentedCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
56i
56i wire bonder ? unbeatable flexibility combined with unique possibilitiesCategory: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
58xx wire bonder
A complete high productivity tabletop wire bonders at over 1 wire per second, with maximum working area 8? x 6?.Category: Wire bonders and die bonders
Producer: F&S Bondtec Semiconductor GmbH
8600C
Automatic large area Pull- & Shear testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
BAMFIT tester
Tester for heavy wire bond connections as an alternative to the shear testCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
Ceramic substrates
Various types and dimensions of alumina ceramics, blank, scribed according to the customer?s designCategory: Materials
Producer:
Die bonder T-4909-AE
Budget sensitive Manual Die BonderCategory: Wire bonders and die bonders
Producer: Dr Tresky
Die bonder T-5100
PC controlled Manual Die Bonder – an universal device for a wide range of micro-assembly tasks.Category: Wire bonders and die bonders
Producer: Dr Tresky
Die bonder T-5300
Manual and semi-automatic die bonder with motorized and programmable Z-axisCategory: Wire bonders and die bonders
Producer: Dr Tresky
Die bonders T-3002-PRO, T-3000-PRO
High Force Multi Application SystemsCategory: Wire bonders and die bonders
Producer: Dr Tresky
Diebonder T-6000, T-6000-L/G, T-8000-G
T-6000-L Flexible Automatic Die Bonder The T-6000-L Die Bonder is a fully-automated all-purpose system for medium sized-, pilot- and R&D production. Equipped with linear motors […]Category: Wire bonders and die bonders
Producer: Tresky Automation
HRX-01- Digital microscope 3D
Digital microscope 3D the latest generation for observation and measurementsCategory: Digital optical microscopes 3D
Producer: Hirox
LAB- TESTER 101
LAB-TESTER 101 – high quality wire bond pull testerCategory: Bond testers
Producer: F&S Bondtec Semiconductor GmbH
NPS (Nano Point Scanner)
The NPS is an innovative non-contact confocal 3D profilometer measuring altitude in real time, for profile or surface scanningCategory: Confocal systems
Producer: Hirox
RH-2000 – Digital microscope 3D
Hirox Full HD 3D Digital Microscope System is the system for contactless 2D& 3D observation with XYZ measurement function and 3D profilling.Category: Digital optical microscopes 3D
Producer: Hirox
RX-100- Digital microscope 3D
Digital microscope 3D the latest generation for observation and measurementsCategory: Digital optical microscopes 3D
Producer: Hirox
