Wire bonders and die bonders- Bond testers
- Printers
- Digital optical microscopes 3D
- Confocal systems
- Laboratory mixers
- Furnaces
- Wafer bonders
- Wafer cleaners
- Devices for photolithography
- Nanoimprint devices
- Electron beam lithography systems
- Ion beam lithography systems
- Devices for maskless lithography
- Devices for production the most accurate large-area, high-resolution image mosaics
- Devices for LTCC technology
- Devices for thick film photoimagible pastes
- Encapsulation devices
- Dicing saws
- Materials
53xx
Description:
The 53XX series are manual wire bonders.
– 5310 manual wire bonder for ball ?wedge connections, 17.5-50 um thickness of gold wire;
– 5330 manual wire bonder for wedge-wedge connections, 17.5-75 um thickness of gold or aluminum wire;
– 5350 manual bonder for wedge-wedge connections, 100-500 um thickness of aluminum wire;
– 53XX-BDA ? wire bonder with a universal head that allows to use two connection processes: as a ball bonder or a Deep Access wedge-wedge bonder It is a bonder for thin gold or aluminum wire and tape. Motorized Y-axis movement is also possible. Perfect for research work in laboratories, making prototypes, but also production series and repairing connections, where high quality and a limited budget are required.