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Die bonder T-4909-AE
Producer:
Dr Tresky
Application:
Electromobility
Microassembly
Semiconductor electronics
Thick film hybrids and LTCC
Category:
Wire bonders and die bonders
Description:
T-4909-AE
Budget sensitive Manual Die Bonder
The T-4909-AE is Tresky’s 40-year anniversary model. On basis of the T-4909 we developed a new software running on an integrated Raspberry PC. Like all Tresky Die Bonder this pick & place system operates with True Vertical Technology™. The increased travel range, now 95mm on Z, allows working on various bonding heights for Epoxy-, Eutectic- and Flip-Chip processes.
• Manual Z-Axis with digital bond force display
• Integrated Dispenser
Excellent performance, ergonomically designed and high reliability makes the T-4909-AE ideal for small and medium volume production.
Application:
Die Attach, Flip-Chip, MEMS, MOEMS, VCSEL, RFID, Adhesive Bonding, Eutectic Bonding.