Description:

Fast void inspection of bonded wafer stacks

The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission supports void detection down to a radius of 0.5 mm. The infrared inspection system is a perfect match for fusion bonding processes either as the stand-alone EVG20 tool or as a station in EVG’s integrated bonding systems.

Features

• Live imaging
• One-shot inspection of the entire wafer
• Optional bond pin for live visualization of direct bonding
• Maszara test compatible
• Void size detection down to 0.5 mm radius