Description:

Atmosphere controlled muffle furnace for many applications: flux-free Hydrogen wafer bump reflow, glass-to-metal bonding, direct bond copper, brazing, sintering, other heat treatment of metals and ceramics.

Maximum firing temperature 1150C

Various firing atmospheres including Hydrogen and Nitrogen

Thanks to the patented BTU gas barrier technology, a perfect clean atmosphere is achieved. In addition, unique steam jet pump technology can be used to enhance cooling or atmosphere control of the process. The end result is high efficiency, excellent performance and thermal homogeneity.